T. Happonen, "TTCN3 applicability to remote embedded testing of electronics," ETSI TTCN-3 User Conference 2008: Madrid (Spain), June 3-6, 2008.
Added by: Deleted user (22 Aug 2008 10:39:36 Europe/Berlin) Last edited by: Deleted user (22 Aug 2008 11:35:49 Europe/Berlin)
|Resource type: Conference Paper
BibTeX citation key: Happonena
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Publisher: MTP, ETSI (Madrid (Spain))
Collection: ETSI TTCN-3 User Conference 2008
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The proposed presentation aims to evaluate the applicability of TTCN-3 for remote embedded testing of electronics purposes. The presentation is based on experiences to implement a generally applicable test communication procedure by TTCN-3. The presentation conforms the following guidelines.
•In introduction section our approach to remote embedded testing is presented and a solution to generally applicable test communication procedure (UTCS, Universal Test Communication Standard) is introduced. This solution is intended to be used as an interface in remote controlled embedded testing.
•Theoretical part is used to relate UTCS capabilities into existing specifications (for example TCI, TTCN-3 Control Interface).
•Empirical part describes the experiences in implementing UTCS accordant test communication by TTCN-3 and illustrates the achieved results.
•Discussion section finally evaluates and comes to conclusions regarding the applicability of TTCN-3 to remote embedded testing based on a chosen approach.
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